Products

Semiconductor

Manufacturing microchips is very complex and costly. Hundreds of automated process steps are required to produce a modern microprocessor from the raw material, quartz sand. The most common base for chips are discs of silicon crystals, called wafers. The requirements made of these discs are increasing every year. This is because ultra-thin, extremely durable and perfectly smooth wafers with unevenness of only a few nanometres are necessary for ever smaller and even more powerful microchips – and thereby for  smartphones, laptops, electronically controlled machines or intelligent cars of the future. ACCRETECH offers you ultra-modern machines and systems which you can use to manufacture precisely the types of wafers required in the semiconductor industry. We see ourselves not only as a developer and manufacturer, but also as a service provider and partner. Our global and European presence with a full sales and service network, as well as an application and demo centre in Munich, guarantees optimal support to our clients.

CMP

Chemical mechanical planarisation (CMP), often called chemical mechanical polishing, is a process of polishing to a thin layer level. CMP was originally developed for use with typical semiconductor materials but is also being increasingly used in manufacturing micro systems. CMP is essential for low-K materials and in the manufacture of sensitive wafers whose surface consists of two materials made from one material compound, for example. Due to the different hardnesses and electricity of both materials, purely mechanical processing in this case would lead to notches in the material transition areas. Available in 3 range, the CMP lineup offers enhance process capability at a reasonable initial cost via utilization of proven technology concepts and knowledge.