Semiconductor

ChaMP - 232 & ChaMP 332

  • ChaMP 232 is best suited for wafer size from 100mm and up to 200mm in diameter. 
  • ChaMP 332 is the ideal platform for 300mm wafe processing.
  • Both platforms are equipped with Sylphide, an "Air-float" polishing head technology which enables low pressure high planarity polishing. 
  • Optical End Point Detection system is available as an option for both platform for enhance polishing control with integration into machine GUI
  • Scrub cleaning and Spin Dry system available as option for both platform for enhance process capability and an integrated solution. 
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CMP 232 CMP 332
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