Products

Semiconductor

Manufacturing microchips is very complex and costly. Hundreds of automated process steps are required to produce a modern microprocessor from the raw material, quartz sand. The most common base for chips are discs of silicon crystals, called wafers. The requirements made of these discs are increasing every year. This is because ultra-thin, extremely durable and perfectly smooth wafers with unevenness of only a few nanometres are necessary for ever smaller and even more powerful microchips – and thereby for smartphones, laptops, electronically controlled machines or intelligent cars of the future. ACCRETECH offers you ultra-modern machines and systems which you can use to manufacture precisely the types of wafers required in the semiconductor industry. We see ourselves not only as a developer and manufacturer, but also as a service provider and partner. Our global and European presence with a full sales and service network, as well as an application and demo centre in Munich, guarantees optimal support to our clients.

Wafer Edge Grinding

The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important.

The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC. As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.

Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process.

In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years. We make proposals that achieve the improvement of quality, CoO and yield with our machine.

W-GM-6200

W-GM-5200

W-GM-4200