Products

Semiconductor

Manufacturing microchips is very complex and costly. Hundreds of automated process steps are required to produce a modern microprocessor from the raw material, quartz sand. The most common base for chips are discs of silicon crystals, called wafers. The requirements made of these discs are increasing every year. This is because ultra-thin, extremely durable and perfectly smooth wafers with unevenness of only a few nanometres are necessary for ever smaller and even more powerful microchips – and thereby for  smartphones, laptops, electronically controlled machines or intelligent cars of the future. ACCRETECH offers you ultra-modern machines and systems which you can use to manufacture precisely the types of wafers required in the semiconductor industry. We see ourselves not only as a developer and manufacturer, but also as a service provider and partner. Our global and European presence with a full sales and service network, as well as an application and demo centre in Munich, guarantees optimal support to our clients.

Wafer Dicing

The task of the Dicing Machines is to singulate whole wafers or strips into individual chips and units. Blade Dicers cut the wafers using either hub or hubless saw blades while Laser Dicers cut wafers using Laser instead of blade and is a completely dry process. Our semi and fully automatic ACCRETECH Dicers are able to process wafers from 150 mm, 200 mm to 300 mm diameter. It is also possible to configure Accretech Dicing Machines to saw molded strips into individual units. The AD2000T and AD3000T PLUS , with two opposite-facing spindles, are the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency. In addition to user-friendliness, their excellent properties include high processing speed with a very compact construction. 

300mm
MAE300
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200mm & 300mm
AL3000P
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300mm
PS300
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300mm
A-CS-300
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200mm
SS20 Plus
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150mm
SS10
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