Products

Semiconductor

Manufacturing microchips is very complex and costly. Hundreds of automated process steps are required to produce a modern microprocessor from the raw material, quartz sand. The most common base for chips are discs of silicon crystals, called wafers. The requirements made of these discs are increasing every year. This is because ultra-thin, extremely durable and perfectly smooth wafers with unevenness of only a few nanometres are necessary for ever smaller and even more powerful microchips – and thereby for  smartphones, laptops, electronically controlled machines or intelligent cars of the future. ACCRETECH offers you ultra-modern machines and systems which you can use to manufacture precisely the types of wafers required in the semiconductor industry. We see ourselves not only as a developer and manufacturer, but also as a service provider and partner. Our global and European presence with a full sales and service network, as well as an application and demo centre in Munich, guarantees optimal support to our clients.

Dicing Blades

Dicing blades are saw blades which are used in fully and semi-automatic blade dicing machines. The selection of the right kind of dicing blade is a prerequisite for good sawing quality. ACCRETECH precision dicing blades are available for a vast range of applications and wafer materials. Unique electroplating technology ensures even granulation distribution, and high stability. We also offer our customers dressing plates to further enhance their cutting quality. With Accretech synergy effect, we are able to provide a total solution to all our customer by providing not only the best blade but also the best machine to achieve the best quality possible!

300mm
Nickel Bond Blade
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300mm
Metal bond blade
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300mm
Hub Blade
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300mm
Resin bond blades
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300mm
Hard Metal Saw
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300mm
Dressing plate
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