W-GM-4200

Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness

The non-contact measuring method achieves the stable alignment

Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer

The modular concept to make the optimum process line possible

Low damage grinding method is available, Mirror Finish

Machine specification ready for 2" to 6" wafer or for 4" to 8" wafer

Capable of various material processes, such as chemical compound semiconductor(Si,SiC,GaN,GaAs,LT,Sapphire,etc...)