Semi Automatic Blade Dicing Machine SS30 PLUS

Standard Semi Automatic Single Spindle Dicing machine, for workpiece of up to 300mm in diameter equipped wit high power spindle. 

• Capable to process up to 300mm wafer size on 300mm dicing frame 
• High processing speed: X-axis up to 800 mm/ sec  return speed
• Standard Spindle up to 30,000 rpm @ 2.5kW max rating
• Blade diameter range selectable between from 76mm to 110mm & 90mm to 130mm
• Improved user friendliness via 17inch touch panel and new intuitive Graphical User Interface with Help Function