Semi Automatic Blade Dicing Machine SS30

Standard Semi Automatic Single Spindle Dicing machine, for workpiece of up to 300mm in diameter.

• Capable to process up to 300mm wafer size on 300mm dicing frame 
• High processing speed: X-axis up to 800 mm/ sec  return speed
• Standard Spindle up to 60,000 rpm @ 1.8kW rating with option to upgrade to 2.2kW @ 30,000rpm spindle
• Capable to accomodate blade from 48mm to 60mm in diameter
• Improved user friendliness via 17inch touch panel and new intuitive Graphical User Interface with Help Function