Semi Automatic Blade Dicing Machine AD20T/S

Semi-automatic Twin (T) or Single (S) spindle configuration capable to accomodate workpiece of up to 200mm in diameter.

• Smallest and fastest Semi-Automatic dicing machine capable for full automatic alignment and dicing process with manual loading / unloading of workpiece
• Capable to process up to 200mm wafer size on 200mm dicing frame. 
• High processing speed: X-axis up to 800 mm/ sec return speed
• Standard Spindle up to 60,000 rpm @ 1.8kW 
• Improved user friendliness via 17inch touch panel and new intuitive Graphical User Interface with Help Function