Semiconductor
HRG200X
Semi-automatic High Rigid Grinder for wafers up to 200 mm
- For ultra-hard wafer materials
- Highest grinding speed
- In the process measurement of the wafer thickness
- Automatic Dressing Function
- Ideal for processing individual 200 mm wafers and batch grinding for wafers with a small diameter
- Also available for numerous special applications, such as MEMS wafer handling
- High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
- It extends the lifespan of the grinding stone
- With the In-Process measuring instrument, which is also suitable for wafer processing in piles and which measures the wafer thickness during the procedure
- Inspects the clogging of the grindstone and performs dressing if required
