Full Automatic Wafer Probing Machine UF2000

Fully automatic wafer handling probing platform with high throughput suitable for 120mm to 200mm wafer diameter. A proven platform with long history of performance, accuracy of +/- 1.5um and high functionality to cater to industry requirements. 

• Precision +-1.5 µm, with the newest optics to determine the positioning precision
• Ultra-stable Z/θ platform for Multi-Pin Probing process
• Capable for wide range of probing temperature, from -55C to 200C capable. 
• High flexibility – numerous options such as the double loader
• Simple operation – multifunctional display and touch screen operation
• Each drive axis can be separately controlled – for optimum control of each individual component