Full Automatic Wafer Probing Machine UF190R

Fully automatic wafer prober meant for wafer size ranging from 100mm to 200mm wafer diameter. Machine was designed to be high speed wafer probing platform for smaller wafer sizes. Able to cover a wide scope of application and capable to be upgraded to suit each customers application and requirement. 

• Now with the latest SW and Electronics generation
• Also available for numerous special applications, such as MEMS wafer handling
• Highest speed 300 mm/s in the XY-axis, 30 mm/s in the Z-axis, rotation angle +-5 deg
• With second card feeder as an option
• Wafer Handling with robot arm and backside holding