Semiconductor

Full Automatic Blade Dicing Machine AD3000T-HC PLUS

Fully automatic dicing machine capable of automatic switchover between frame handling and bare wafer handling without the need of any hardware conversion to enable high productivity of half cut dicing process. 

  • World's first dicing machine equipped with an automatic Frame Handling (FH) and Wafer Handling (WH) loader to enable automatic switchover between FH & WH for half cut dicing process
  • Equipped with automatic FOUP / FOSB (SEMI-compliant) cover opener
  • Special Handling arms to realize non contact (top surface) wafer transfer / handling within the machine
  • Active Z as standard function to provide high precision Z height control for better cutting qualitity especially during WH process. 
  • All functions of AD3000T-PLUS is reflected in this model
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AD3000T Plus HC
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  • Built In UV unit is possible to be integrated into the machine as an option
  • 3 inch blade capablity can be intergrated into the machine as an option

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