Semiconductor

Full Automatic Blade Dicing Machine AD2000T/S

Fully automatic frame handling twin spindle dicing machine capable to accommodate workpiece of up to 200mm in diameter. Single spindle configuration, AD2000S can be made available. 

  • Capable to process up to 200mm wafer size on 200mm dicing frame
  • High processing speed: X-axis up to 1,000 mm/ sec & Y-axis up to 300 mm/sec
  • Standard Spindle up to 60,000 rpm compatible with blade up to 60mm in diameter
  • Improved user friendliness via 17inch touch panel and new intuitive Graphical User Interface with Help Function
  • Routine maintenance made easy with large front facing access panel
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AD2000T - S
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  • SECSGEM ready and compatible for integration with customer network or in-house Saw-NET capability
  • Automatic machine condition data acquisition function option is available to log machine conditions such as various flow rates, machine temperature and resistivy of DI water among others. 

Machine Enquiry