Semiconductor
Semi Automatic Blade Dicing Machine SS11
Semi-automatic dicing machine for Φ150mm wafers.
The standard specification completely supports high-precision dicing. Speeding up the X, Y, Z axes contributes to enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A wide range of materials are supported, from silicon to difficult-to-cut materials.
