Probing machine for 300 mm framed wafers FP3000W

It performs the precision measurement using our unique correction technology on cut wafer, package and such that are attached to the dicing frame.
It is the multi-functional prober which performs transfer and testing on a frame as well as wafer with only one click of button by optional function.

Optimization of correction value is realized by the application which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

• 8/12 inch wafer transfer dual mechanism
• 8 inch frame transfer mechanism
• Multiple barcode management
• FFU to realize clean testing environment
• Hinge-type manipulator for test-head
• High-temperature testing environment
• Ultra-high magnification color optical system
• Needle track inspecting function
• PLP testing for diced 300mm square
• PLP testing for up to 330mm square