Semiconductor
PG3000RM II
High accuracy grinding/polish equipment covers device miniaturization and thinning process in recent years
Significantly renewed RM mechanism (DC tape attachment and BG tape demounting)
- Realizes damage-free processing through high accuracy grinding and wet polishing
- Enables high throughput (20 WPH @ 25 um)
- Supports gettering function for memory device
- RM (DC tape attachment and BG tape demounting) system suitable for thin items process
- User-friendly operability and equipped with operation analysis system
