Semiconductor
High Rigid 1-Axis Grinder HRG300A
High Rigid 1-Axis Grinder
Fully Automatic High Rigid 1-Axis Grinder
In addition to the fully automatic transfer of up to Φ200 mm, it supports a wide range of applications such as frame-mounted wafers and boule transfer of up to 50 mm thickness.
Supports full-automation processing of various workpieces such as wafers of up to Φ200 mm,
wafers mounted on the dicing frame,PLP substrates of up to 300 mm on a side,
and boules of up to 50 mm (5 kg) and batch processing
