Semiconductor
Fully Automatic High Rigid 3-Axis Grinder HRG3000RM Ⅱ
High accuracy grinding/polish equipment covers device miniaturization and thinning process in recent years
Significantly renewed RM mechanism (DC tape attachment and BG tape demounting)
- Less-damage Grinding with Shorter Process Time
- Low processing cost
- High Accuracy
- Mirror Finish Surface Grinding
